Appeal No. 2005-0181
Application No. 09/781,631
polyimides, benzocylobutenes, polysulfones, polyetherketones, and
combinations thereof”. The specification also indicates that
encapsulant may include the materials cited in U. S. Patent No.
6,106,891. In the paragraph bridging columns 2 and 3 of U.S.
Patent No. 6,106,891, it is indicated that “conventional FR–4
Epoxy and laminates based on high temperature resins such as
high temperature epoxies, polyimides, cyanates (triazines),
fluoropolymers, ceramic filled fluoropolymers . . .”, can be
used.
Appellants’ claims recite polyimides, cyanate esters, and
combinations thereof, as being “epoxy resin materials” or as
being “epoxy resins”. The examiner’s position is that because
the specification discloses “epoxies, cyanate esters,
bismaleimides cyanate esters-epoxies polyimides, benzocylo-
butenes, polysulfones, polyetherketones, and combinations
thereof”, then, cyanate esters and polyimides are not considered
as being “epoxy resins” or “epoxy resin materials”.
We agree with the examiner’s position because the issue is
whether cyanate esters and polyimides are “epoxy resin materials”
or “epoxy resins”. These compounds do not have an epoxy group.
Also, there is no written description found in appellants’
specification that these compounds have an epoxy group (see
discussion, supra). Appellants’ arguments do not address this
point either.
In view of the above, we therefore affirm the rejection of
claims 35, 56, and 66.
With regard to claim 36, the examiner states that no support
can be found for “at least one aliphatic polyol substance of
between approximately 0 and 2 percent” by weight. Answer, page
4. Appellants state that the recited percentage of “0 to 2
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