Appeal No. 2005-0234
Application No. 09/901,550
11. A support matrix for integrated semiconductors, comprising:
a frame having at least one bonding channel with an edge formed
therein;
conductor track structures disposed on said frame;
contacts, selected from the group consisting of bonding leads and
wires, connected to said conductor track structures and disposed
in said bonding channel, said contacts used for connecting said
conductor track structures to an integrated circuit; and
a barrier formed along said edge, said barrier having a parting
agent disposed thereon for repelling a flowable material from
said bonding channel onto said frame and onto said conductor
track structures.
The prior art references of record relied upon by the
examiner in rejecting the appealed claims are:
Wiech, Jr. (Wiech) 4,562,092 Dec. 31, 1985
Roberts et al. (Roberts) 4,599,636 Jul. 08, 1986
Claims 1 through 3, 5 through 7, and 11 stand rejected under
35 U.S.C. § 102(b) as being anticipated by Wiech.
Claim 4 stands rejected under 35 U.S.C. § 103 as being
unpatentable by Wiech in view of Roberts.
Reference is made to the Examiner's Answer (Paper No. 18,
mailed June 20, 2003) for the examiner's complete reasoning in
support of the rejections, and to appellants' Brief (Paper No.
17, filed April 16, 2003) and Reply Brief (Paper No. 19, filed
August 22, 2003) for the appellants' arguments thereagainst.
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