Ex Parte Manginell et al - Page 1



         The opinion in support of the decision being entered today was             
         not written for publication and is not binding precedent of the            
         Board.                                                                     


                     UNITED STATES PATENT AND TRADEMARK OFFICE                      
                                     __________                                     
                         BEFORE THE BOARD OF PATENT APPEALS                         
                                 AND INTERFERENCES                                  
                                     __________                                     
                           Ex parte RONALD P. MANGINELL,                            
                         W. KENT SCHUBERT, and RANDY J. SHUL                        
                                     __________                                     
                                Appeal No. 2005-0237                                
                             Application No. 10/165,861                             
                                     __________                                     
                                      ON BRIEF                                      
                                     __________                                     
         Before GARRIS, WARREN, and DELMENDO, Administrative Patent                 
         Judges.                                                                    
         GARRIS, Administrative Patent Judge.                                       
                                 DECISION ON APPEAL                                 
              This is a decision on an appeal which involves claims 1-5.            
              The subject matter on appeal relates to a method for                  
         fabrication of silicon-based microstructures comprising the                
         deposition and patterning of an etching delay layer on a surface           
         of a substrate.  The method further comprises an etching process,          
         the thickness and location of the etching delay layer being                
                                         1                                          




Page:  1  2  3  4  5  6  Next 

Last modified: November 3, 2007