Appeal No. 2005-0346
Application. 09/897,891
Invention
Appellants’ invention relates to an integrated circuit chip
having a logic core which includes a plurality of insulating and
conducting levels, an exterior conductor level, and passive
devices having a conductive polymer directly connected to the
exterior conductor level. The passive devices contain RF devices
which also include at least one resistor, capacitor, and
inductor. The resistors can be serpentine resistors and the
capacitors can be interdigitated capacitors. Appellants’
specification at page 2, lines 13-18.
Claim 1 is representative of the claimed invention and is
reproduced as follows:
1. An integrated circuit chip structure comprising:
an integrated circuit chip comprising:
a logic core;
a plurality of insulating and conducting levels above
said core; and
an exterior conductor level above said insulating and
conducting levels; and
passive devices comprising a conductive polymer
directly connected to said exterior conductor level of said
integrated circuit chip, such that said passive devices comprise
an integral part of said integrated circuit chip.
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