Appeal No. 2005-0646 Page 2
Application No. 10/278,184
Representative claim 15 is reproduced as follows:
15. A printed circuit heater formed by a process comprising
the steps of:
a) depositing a thin metal or metal alloy layer onto a surface of
a metal carrier foil, which thin metal or metal alloy layer has a
thickness of about 0.1 :m to about 2 :m, thereby forming a
composite;
b) attaching the composite to a substrate such that the thin
metal or metal alloy layer is in contact with the substrate,
thereby forming a laminate;
c) selectively removing at least a portion of the metal carrier
foil from portions of the laminate; and
d) patterning and etching the thin metal or metal alloy layer
such that the etched thin metal layer has a heat density of from
about 0.5 watts/in2 to about 20 watts/in2 at voltages from about
3 volts to about 600 volts.
The examiner relies on the following references:
Sato et al. (Sato) 4,882,455 Nov. 21, 1989
Lindblom et al. (Lindblom) 5,038,132 Aug. 06, 1991
Lee et al. (Lee) 6,194,990 Feb. 27, 2001
Teshima et al. (Teshima) 6,457,632 Oct. 01, 2002
Claims 15-18 and 23-28 stand rejected under 35 U.S.C.
§ 102(b) as being anticipated by the disclosure of Lee. Claims
19-22 stand rejected under 35 U.S.C. § 103(a) as being
unpatentable over the teachings of Lee in view of Sato, Teshima
or Lindblom.
Rather than repeat the arguments of appellants or the
examiner, we make reference to the briefs and the answer for the
respective details thereof.
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