Appeal No. 2005-0840
Application No. 09/847,447
except for the alignment elements and devices recited in claim
1.1 Compare the Answer in its entirety with the Brief and the
Reply Brief in their entirety. The dispositive question is,
therefore, whether the claimed alignment elements and devices, as
properly interpreted, embrace the contact pads and contact pads
having solder described in Li or Seraphim. We answer this
question in the affirmative.
As found by the examiner (Answer, pages 3-4), Li teaches
employing a plurality of contact (locator) pads on emissive
display modules (tiles) and a back frame (base plate) for the
alignment purpose. We find that Li teaches at, e.g., column 1,
lines 43-57, that:
The alignment of tiles is accomplished by
precisely and accurately positioning locator pads on
the base plate to which the tiles are to be mounted,
and positioning corresponding locator pads on the
surface of the tile which will be adjacent the base
plate. Conventional lithographic techniques permit the
location of such pads with an accuracy of less than a
few microns, thus enabling the horizontal position of a
tile to be precisely located on the base plate, or
substrate. The locator pads are of a material which
will accept a flowable joint material which can be
deposited on one set of pads. The tiles are then
positioned over the base plate with the joint material
aligned with the locator pads on the base plate, and
1 The appellants also state at page 5 of the Brief that
“[a]ll of the claims may be grouped with claim 1 for convenience
on appeal.”
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