Appeal No. 2005-0918 Page 5
Application No. 09/785,423
a tape carrier package part on the package film defined by depressions,
said tape carrier package part having a mounting portion for receiving an
integrated circuit;
wherein a plurality of punching holes are formed along a border of the
tape carrier package part and the peripheral part, the punching holes assisting
separation of the tape carrier package part from the peripheral part.
In our view, the combination of Honda and Hashimoto as set forth in the rejection
under appeal does not arrive at the subject matter of either claim 1 or claim 5 for the
reasons set forth by the appellants in the brief and reply brief. In particular, the
following limitations are not taught or suggested by the applied prior art: (1) a plurality of
punching holes formed by cutting a part of the tape carrier package part and a part of
the peripheral part for reducing a connection between the tape carrier package part and
the peripheral part as recited in claim 1; and (2) a plurality of punching holes are formed
along a border of the tape carrier package part and the peripheral part, the punching
holes assisting separation of the tape carrier package part from the peripheral part as
recited in claim 5. Honda's recesses 34' are formed by embossing film or sheet
material.2 As such, the lead storing parts 34b' of the recesses 34' are not punching
2Each recess 34' comprises a main body storing part 34a responding to the
shape or size of the main body 20a' of the electronic component 20', and two lead
storing parts 34b' for storing the two leads 20b' of the electronic component 20'.
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