Appeal No. 2005-0999
Application No. 09/939,356
at least two discrete thermally conductive
solderable elements mechanically fixed to respective
said mounting lands, each said element having a first
planar surface which is contiguous with a respective
said planar bottom surface of said heat sink body and
an opposed second planar surface for soldering to said
circuit board, said first and second planar surfaces
being substantially parallel.
The examiner relies upon the following references in the
rejection of the appealed claims:
Rosenbaum1 2,965,819 Dec. 20, 1960
Takahashi 5,528,456 Jun. 18, 1996
Pavlovic 6,055,158 Apr. 25, 2000
Pei et al. (Pei) 6,230,789 May 15, 2001
(filed Jun. 25, 1999)
Appellants’ claimed invention is directed to a heat sink
device that is mounted to the surface of a circuit board. The
device comprises a body that consists essentially of aluminum
having two mounting lands, and thermally conductive solderable
elements that are mechanically fixed to the mounting lands. One
set of the solderable elements is mechanically fixed to and
contiguous with the planar bottom surface of a mounting land,
while the opposite surface of the solderable element is soldered
to the circuit board.
1 It is noted that the examiner has not listed the Rosenbaum
reference in the Prior Art of Record in the Answer. However as
Rosenbaum is relied upon in the rejection of claims 6 and 7, we view
this as a harmless error.
2
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