Appeal No. 2005-1099
Application No. 09/334,974
depositing by electroplating at least one metal
or metal alloy containing layer on at least a portion
of said article surface;
subjecting said article surface having said at
least one electroplated layer thereon to pulses of air
to dry and clean said electroplated article surface;
and
depositing by physical vapor deposition on at
least a portion of said dry and clean electroplated
layer at least one layer comprising a material
selected from the group consisting of refractory
metal, refractory metal alloy, refractory metal
compound, and refractory metal alloy compound on at
least a portion of said electroplated layer, wherein
said refractory metal compound is selected from the
group consisting of nitrides, carbides, carbonitrides,
oxides and reaction products of said refractory metal,
oxygen and nitrogen, and wherein said refractory metal
alloy compound is selected from the group consisting
of nitrides, carbides, carbonitrides, oxides and
reaction products of said refractory metal alloy,
oxygen and nitrogen.
7. The process of claim 1 wherein said refractory
metal compound is selected from nitrides, oxides and
reaction products of refractory metal, oxygen and
nitrogen, and said refractory metal alloy compound is
selected from nitrides, oxides and reaction products
of refractory metal alloy, oxygen and nitrogen.
10. The process of claim 1 wherein said
electroplating comprises electroplating at least one
layer comprised of copper on said at least a portion
of the surface of said article to provide at least one
electroplated copper layer, electroplating at least
one layer comprised of nickel on said at least one
electroplated copper layer to provide at least one
electroplated nickel layer, and electroplating at
least one layer comprised of chrome directly on said
at least one electroplated nickel layer.
26. The process of claim 22 wherein said
refractory metal compound is selected from nitrides,
oxides and reaction products of refractory metal,
2
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