Appeal No. 2005-1695
Application No. 09/817,843
3 of the answer and in the ensuing responsive arguments, the
examiner asserts that the element 22 in figure 2 of Elenius
corresponds to the claimed dielectric packaging substrate and
that the element 30 comprises the claimed conductive foil having
a smooth portion which is laminated with the major surface of the
dielectric packaging substrate. In asserting the rejection, the
examiner makes no reference to the corresponding specification
teachings in Elenius to substantiate the assertions made.
With respect to the rejection of claim 1 under 35 U.S.C.
§ 102, we reverse this rejection and the rejection of its
respective dependent claims under 35 U.S.C. § 102 and 35 U.S.C.
§ 103 because the examiner has not set forth a prima facie case
of anticipation of independent claim 1 as generally asserted by
appellants in the brief and reply brief. In figure 2 the
semiconductor wafer 14 has a front surface 12 onto which is
placed a die wafer passivation layer 22, to which in turn the
redistribution trace 30 is placed. It is this redistribution
metal layer 30 that forms the solder bump pads 26 as well as the
conductive bond pads 32 to the left of figure 2. The summary of
the invention of Elenius at columns 3 through 5 also generally
characterizes this redistribution layer as a patterned metal
layer.
3
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