Appeal No. 2005-2013 Page 2
Application No. 10/140,324
BACKGROUND
The Appellants’ invention relates to a showerhead adapted for distributing gases
into a processing chamber and a processing chamber. According to Appellants, the a
processing chamber is suitable for chemical vapor deposition utilizing a common
process kit for forming various dielectric layers on a substrate. (Brief, pp. 2-3).
Representative claims 1 and 17 are reproduced below:
1. A showerhead for distributing gases in a processing chamber
comprising:
a face plate having a plurality of holes formed therethrough, each hole
including a restrictive section, a center passage section, and an opening
section;
an annular body having a first end coupled to a first side of the face plate;
a mounting flange coupled to a second end of the annular body; and
an annular lip extending from a second side of the face plate opposite the
mounting flange and defining a peripheral boundary to a plasma
containing region.
17. A processing chamber comprising:
a chamber body;
a lid disposed on the chamber body;
a substrate support disposed in the chamber body;
a face plate having a plurality of at least partially tapered holes formed
therethrough, each hole including a restrictive section, a center passage
section, and an opening section, the face plate disposed between the lid
and the substrate support;
an annular body having a first end coupled to a first side of the face plate;
a mounting flange coupled to a second end of the annular body and
coupled to the lid; and
an annular lip extending a second side of the face plate opposite the
mounting flange and defining an angle of between about 80 and about 90
degrees relative to the face plate, wherein the lip is adapted at least
partially for confining a plasma proximate
the face plate, an inner diameter of the lip having a diameter less than a
diameter of the substrate support.
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