Appeal No. 2005-2711
Application No. 10/028,015
an intermediate metallization layer on a lower portion of a
package to remain visible beyond the extent of an upper portion
of the package for indicating an orientation of the package. An
understanding of the invention can be derived from a reading of
exemplary independent claim 1, which is reproduced as follows:
1. A substrate for a device package comprising:
a lower portion of a package;
an intermediate metalization layer on a top surface of said
lower portion;
an upper portion of said package on said top surface of said
lower portion, a corner portion of said intermediate metalization
layer remaining visible beyond the extent of said upper portion
for indicating an orientation of said substrate.
The Examiner relies on the following references:
Guzuk et al. (Guzuk) 5,153,379 Oct. 6, 1992
Ueda et al. (Ueda) 6,037,698 Mar. 14, 2000
Claims 1 and 3-8 stand rejected under 35 U.S.C. § 102(b) as
being anticipated by Guzuk.
Claims 1 and 2 stand rejected under 35 U.S.C. § 102(e) as
being anticipated by Ueda.
Claim 9 stands rejected under 35 U.S.C. § 103(a) as being
unpatentable over Guzuk.
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