Ex Parte Atia et al - Page 4




             Appeal No. 2005-2754                                                                                                                 
             Application No. 10/391,835                                                                                                           


              LoVasco to provide a reusable alignment tool for optical components, while allowing for                                             
              a more simplified bench structure.  We agree.                                                                                       


              Appellants’ argument that the prior art does not expressly show, teach or suggest                                                   
              that spacers and a removable template should be used for “optical component”                                                        
              positioning on an optical bench is noted, but for the reasons set forth by the examiner                                             
              on pages 5 and 6 of the answer is not persuasive.  Moreover, for the reasons set forth                                              
              in the answer on pages 6 and 7, appellants’ assertion that Silhavy does not suggest a                                               
              “removable” template is likewise not persuasive.                                                                                    


              From our perspective the discussions in LoVasco and Silhavy concerning the                                                          
              importance of controlling solder joint geometry by providing spacers and lateral                                                    
              alignment fixtures during a solder reflow process and providing solder joints without                                               
              using flux                                                                                                                          
              are applicable to the joining of semiconductor chips as well as optical components to                                               
              bench or package substrate structures like those acknowledged by appellants on page                                                 
              1 of the specification to exist in the prior art.  We do not see any reason why an                                                  
              unpopulated bench precursor structure for use with semiconductor electronic chips                                                   
              would necessarily be different from an unpopulated bench precursor structure used for                                               
              the structural                                                                                                                      

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