Appeal No. 2006-0031
Application 09/377,286
1. A bond pad assembly comprising:
a bond pad;
a trace that applies an attractive force to solder placed on
the pad, said trace coupled to said pad and extending away from said
pad in a first direction; and
a trace stub to counteract the attractive force applied by the
trace, said trace stub coupled to said pad and extending away from
said pad in a direction other than said first direction.
10. A bonding system comprising:
a bond pad;
a trace coupled to said bond pad and extending away from said
pad; and
an element adapted to counteract an attractive force applied by
the trace to solder placed on the bond pad.
THE REFERENCE
Healy et al. (Healy) 3,537,176 Nov. 3, 1970
THE REJECTION
Claims 1-6, 10-12, 14, 16 and 19 stand rejected under 35 U.S.C.
§ 102(b) as being anticipated by Healy.
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