The opinion in support of the decision being entered today was not
written for publication and is not binding precedent of the Board.
UNITED STATES PATENT AND TRADEMARK OFFICE
____________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
____________
Ex parte TING CHIEN, CHRISTINE NELSON, and DOUGLAS KEIL
____________
Appeal No. 2006-0291
Application No. 09/820,692
____________
ON BRIEF
____________
Before PAK, WALTZ, and JEFFREY T. SMITH, Administrative Patent
Judges.
WALTZ, Administrative Patent Judge.
DECISION ON APPEAL
This is a decision on an appeal from the primary examiner’s final rejection of
claims 1 through 4, 7 through 12, and 14 through 27, which are all of the claims pending
in this application. We have jurisdiction pursuant to 35 U.S.C. § 134.
According to appellants, the invention is directed to a method of etching a
dielectric layer with selectivity to an underlying stop layer comprising supporting a
semiconductor substrate in a plasma etch chamber of a dual frequency capacitively
coupled plasma reactor having a powered showerhead electrode and/or a powered
bottom electrode, where an etchant gas comprising a hydrogen-free fluorocarbon gas
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