Ex Parte Kang et al - Page 6



         Appeal No. 2006-0378                                           6                           
         Application No. 10/052,703                                                                 

              We, therefore, find that the Examiner has failed to                                   
         establish anticipation of the subject matter of claim 1 and                                
         claims 2-8 dependent thereon within the meaning of                                         
         35 U.S.C. § 102 because the Examiner has not shown that each and                           
         every limitation is met by the shower head of Chen.                                        
              Turning to claim 9, this claim is directed to an apparatus                            
         including a heater stage located in a lower portion of a process                           
         chamber and a separating device arranged between a bottom of the                           
         process chamber and a bottom of the heater stage.  Claim 9 reads                           
         as follows:                                                                                
                   9.  An apparatus for forming a thin film, said                                   
              apparatus comprising:                                                                 
                   a process chamber;                                                               
                   a heater stage located in a lower                                                
                             portion of the process                                                 
                             chamber, said heater                                                   
                             stage configured to                                                    
                             support a wafer and to                                                 
                             heat the wafer to a high                                               
                             temperature;                                                           
                   a shower head located in an upper portion of the                                 
              process chamber, said shower head configured to supply                                
              a reaction gas to the wafer; and                                                      
                   a separating device arranged between a bottom of                                 
              the process chamber and a bottom of the heater stage,                                 
              said separating device configured to separate the                                     
              heater stage from the bottom of the process chamber and                               
              to reduce a volume of processing space within the                                     
              process chamber.                                                                      













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