Appeal No. 2006-0497
Application No. 10/444,772
BACKGROUND
The invention is directed to a system and method to increase die stand-off height
in a flip chip. Claim 1 is reproduced below.
1. A system for increasing die stand-off height in a flip chip, comprising:
a die;
a substrate positioned generally parallel with, and spaced apart from, the
die;
a plurality of separator pedestals disposed between a first face of the die
and a second face of the substrate;
the first face being opposite the second face; and
the plurality of separator pedestals being operable to selectively force the
die and substrate apart.
The examiner relies on the following references:
Dockerty et al. (Dockerty) 6,053,394 Apr. 25, 2000
Earnworth et al. (Earnworth) US 6,649,444 B2 Nov. 18, 2003
(filed Oct. 24, 2001)
Claims 1-6, 8, and 9 stand rejected under 35 U.S.C. § 102 as being anticipated
by Earnworth.
Claim 7 stands rejected under 35 U.S.C. § 103 as being unpatentable over
Earnworth and Dockerty.
Claims 10-27 have been withdrawn from consideration.
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