Appeal No. 2006-0513
Application No. 09/741,684
material to a metal bonding pad of the suspension. More
particularly, a slider bonding pad, which initially has no
bonding substance, is coupled to the suspension by the reflowing
of the bonding substance on the suspension bonding pad, thereby
coupling the suspension bonding pad to the slider bonding pad.
Claim 7 is illustrative of the invention and reads as
follows:
7. A suspension comprising:
a suspension bonding pad for electrically bonding a magnetic
head terminal, wherein said bonding pad includes a metal pad
having a bonding substance applied as a surface finishing
material, the surface finishing material being heat treated prior
to bonding to a surface; and
a slider bonding pad initially without bonding substance
coupled to said suspension such that the bonding substance on
said suspension bonding pad is reflowed so as to electrically
couple the suspension bonding pad and the slider bonding pad.
The Examiner relies on the following prior art:
Ainslie et al. (Ainslie) 4,761,699 Aug. 02, 1988
Albrecht et al. (Albrecht) 5,821,494 Oct. 13, 1998
Claims 7-11 stand finally rejected under 35 U.S.C. § 102(b)
as being anticipated by either one of Ainslie or Albrecht.
Claims 12 stands finally rejected under 35 U.S.C. § 103(a) as
being unpatentable over either one of Ainslie or Albrecht.
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