Appeal No. 2006-0595
Application No. 09/932,860
or atomic layer deposition (ALD), where the chamber includes a
chamber body, a chamber lid, a chamber cavity, a vapor delivery
head, with a gas delivery path traveling through the chamber body
via a feedthrough device (Brief, page 3). A heating device 1
which includes at least one resistor element having at least a
portion thereof disposed within a thermally conductive sheathing
is associated with the feedthrough device, a layer of thermal
insulation is disposed between at least a portion of the
sheathing and the chamber body, and a temperature sensing device
is disposed between the layer of insulation and the longitudinal
body portion of the feedthrough device (Brief, pages 3-4). A
copy of representative independent claim 1 may be found in
Appendix A attached to appellants’ Brief.
The examiner has relied upon the following references as
evidence of obviousness:
Whitney 4,638,150 Jan. 20, 1987
Fukuda et al. (Fukuda) 5,496,410 Mar. 05, 1996
Sajoto et al. (Sajoto) 6,056,823 May 02, 2000
The claims on appeal stand rejected under 35 U.S.C. § 103(a)
as unpatentable over Sajoto in view of Whitney and Fukuda (Office
action dated Jan. 10, 2005, page 5; Brief, page 4, paragraph 6;
1We refer to and cite from the Supplemental Brief dated
April 13, 2005.
2
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