Appeal No. 2006-0977
Application 10/250,605
composition of Japanese ‘306. The motivation for such a selection
arises from both the teaching in Japanese ‘306 that all epoxy resins
may be used and the disclosure in Japanese ‘349 that the claimed
epoxy resin lowers “the viscosity of the composition to provide
higher filler loadings leading to improved reflow crack resistance
and moisture resistance” (page 4 of answer, second paragraph).
Appellants point to specification data for demonstrating that
the composition of the present invention is flame retardant in the
absence of conventional flame retardant additives and that “the
compositions provide a good balance of moldability and solder crack
resistance” (page 4 of brief, first paragraph). In particular,
appellants cite Example 2 and Comparative Example A for
demonstrating that the presence of the thiophenol provides “the
favorable combination of both flame retardancy and solder crack
resistance” (page 4 of brief, second paragraph).
We agree with the examiner that the specification data does not
address the thrust of the examiner’s rejection inasmuch as the epoxy
resin encapsulating composition of Japanese ‘306 contains the
thiophenol which appellants assert is responsible for the favorable
combination of properties. Hence, the specification data does not
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