Appeal No. 2006-1341
Application No. 09/782,180
Tamaki et al. (Tamaki) 6,136,668 Oct. 24, 2000
Sakaguchi et al. (Sakaguchi) 6,150,194 Nov. 21, 2000
Takahashi et al. (Takahashi) 6,153,448 Nov. 28, 2000
Horiuchi et al. (Horiuchi) 6,242,799 Jun. 5, 2001
Ohuchi 6,271,588 Aug. 7, 2001
Toyosawa 6,337,257 Jan. 8, 2002
Appellants’ claimed invention is directed to a semiconductor
device, and method of making it, comprising a substrate having an
external connecting electrode on one surface and having the
opposite surface abrased with a mirror finish. The surface of
the substrate having a mirror finish is provided with a
reinforcement member, such as a coating of resin. According to
appellants “the semiconductor device has a reduced thickness so
that it can bend while a level of rigidity can be assured as the
semiconductor is reinforced with a back surface reinforcing
member of resin” (page 3 of principal brief, first paragraph).
The appealed claims stand rejected under 35 U.S.C. § 103(a)
as follows:
(a) claims 1 and 17 over Toyosawa,
(b) claims 2 and 4 over Toyosawa in view of Ohuchi,
(c) claim 3 over Toyosawa in view of Ohuchi and
Horiuchi,
(d) claims 5-8 and 18 over Tamaki,
(e) claims 9-12 over Tamaki in view of Sakaguchi, and
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