Ex Parte Mita et al - Page 1






                                       The opinion in support of the decision being entered                                          
                                  today was not written for publication and is not binding                                           
                                  precedent of the Board.                                                                            
                                  UNITED STATES PATENT AND TRADEMARK OFFICE                                                          
                                                        _______________                                                              
                                        BEFORE THE BOARD OF PATENT APPEALS                                                           
                                                     AND INTERFERENCES                                                               
                                                        _______________                                                              
                                     Ex parte KUNIHIKO MITA, KAZUHIKO TOMARU,                                                        
                                          YOSHITAKA AOKI and HIRONAO FUJIKI                                                          
                                                         ______________                                                              
                                                      Appeal No. 2006-1352                                                           
                                                      Application 10/250,683                                                         
                                                        _______________                                                              
                                                      HEARD: July 11, 2006                                                           
                                                        _______________                                                              
               Before FRANKFORT, WARREN and BAHR, Administrative Patent Judges.                                                      
               WARREN, Administrative Patent Judge.                                                                                  
                                                        Decision on Appeal                                                           
                       This is an appeal under 35 U.S.C. § 134 from the decision of the examiner finally                             
               rejecting claims 1 through 5 and 7 through 20, all of the claims in the application.                                  
                       Claims 1 and 10 illustrate appellants’ invention of a heat dissipating member, and are                        
               representative of the claims on appeal:                                                                               
                       1.  A heat dissipating member which is disposed between a heat generating electronic                          
               component which when operated generates heat and reaches a temperature higher than room                               
               temperature and a heat dissipating component, wherein the heat dissipating member is non-fluid                        
               in a room temperature state prior to operation of the electronic component and acquires a low                         
               viscosity, softens or melts under heat generation during operation of the electronic component to                     
               fluidize at least a surface thereof so as to fill between the electronic component and the heat                       
               dissipating component without leaving any substantial voids, and the heat dissipating member is                       
               formed of a composition comprising a silicone resin and a heat conductive filler, and                                 
                       wherein the heat conductive filler is a mixture of a filler having an average particle size                   
               of 0.1 to 5 µm and a filler having an average particle size of 5 to 25 µm.                                            

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