The opinion in support of the decision being entered
today was not written for publication and is not binding
precedent of the Board.
UNITED STATES PATENT AND TRADEMARK OFFICE
_______________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
_______________
Ex parte KUNIHIKO MITA, KAZUHIKO TOMARU,
YOSHITAKA AOKI and HIRONAO FUJIKI
______________
Appeal No. 2006-1352
Application 10/250,683
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HEARD: July 11, 2006
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Before FRANKFORT, WARREN and BAHR, Administrative Patent Judges.
WARREN, Administrative Patent Judge.
Decision on Appeal
This is an appeal under 35 U.S.C. § 134 from the decision of the examiner finally
rejecting claims 1 through 5 and 7 through 20, all of the claims in the application.
Claims 1 and 10 illustrate appellants’ invention of a heat dissipating member, and are
representative of the claims on appeal:
1. A heat dissipating member which is disposed between a heat generating electronic
component which when operated generates heat and reaches a temperature higher than room
temperature and a heat dissipating component, wherein the heat dissipating member is non-fluid
in a room temperature state prior to operation of the electronic component and acquires a low
viscosity, softens or melts under heat generation during operation of the electronic component to
fluidize at least a surface thereof so as to fill between the electronic component and the heat
dissipating component without leaving any substantial voids, and the heat dissipating member is
formed of a composition comprising a silicone resin and a heat conductive filler, and
wherein the heat conductive filler is a mixture of a filler having an average particle size
of 0.1 to 5 µm and a filler having an average particle size of 5 to 25 µm.
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