Ex Parte Pylant et al - Page 4



            Appeal No. 2006-1377                                                         Page 4              
            Application No. 10/621,031                                                                       


                   Rather than reiterate the conflicting viewpoints advanced by the examiner                 
            and the appellants regarding this appeal, we make reference to the examiner's                    
            answer (mailed January 20, 2006) for the examiner's complete reasoning in support                
            of the rejection and to the appellants’ brief (filed August 29, 2005) and reply brief            
            (filed February 2, 2006) for the appellants’ arguments thereagainst.                             
                                            OPINION                                                          
                   In reaching our decision in this appeal, we have given careful consideration              
            to the appellants’ specification and claims, to the applied prior art, and to the                
            respective positions articulated by the appellants and the examiner.  For the                    
            following reasons, we cannot sustain the rejection.                                              
                   Appellants’ independent claims 15 and 19 each require at least one                        
            alignment artifact disposed on a wafer assembly or wafer element and at least one                
            orientation artifact disposed within a wafer storage container.  Claim 15 further                
            recites a step of engagement of the at least one alignment artifact on the wafer                 
            assembly with the at least one orientation artifact disposed within the container and            
            claim 19 recites a step of placing the wafer element in the container so that the                
            alignment artifact of each wafer element mates with at least one orientation artifact            
            of the container.  Neither of the applied references, alone or in combination,                   
            teaches or suggests such a step.                                                                 











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