Appeal No. 2006-1437
Application No. 10/782,161
placed in inner base 42. IC chip 60 (Fig. 7) is adhered to carrier 62 and placed atop
insulating film 32 (Fig. 2). Figure 3 also depicts compressive coil springs 44, which are
shown under compression in Figure 2; i.e., with cover 12 closed.
The plurality of springs 44 are provided for supporting the intermediate support
plate 40 (Fig. 3) in a horizontal position. The intermediate support plate is placed and
supported on the compressive coil springs 44 with respective positioning pins 30. Col.
5, ll. 4-27. As shown in Figure 2, as cover 12 is closed and latched, carrier 62 and IC
chip 60 are pressed downward toward the bottom of base cavity 10b. The compressive
force from holding pad 56 is additive to the upward force of compressive coil springs 44.
The springs when compressed force greater contact between insulating film 32 and IC
chip 60. In order to remove IC chip 60 from the socket, the latch 24 is moved to the
release position and the cover 12 is opened. Carrier 62 can then be picked up by a tool
such as a pair of tweezers. IC chip 60 may then be removed from carrier 62. Col. 6, l.
40 - col. 7, l. 7.
Ikeya thus discloses moving a load plate (cover 12) from a closed position that
compresses the processor into the socket to an open position, and activating an
extraction device (e.g., compressive springs 44) by movement of the load plate from the
closed position to the open position. The processor is extracted from the socket with
the activated extraction device within the meaning of the claims, because the springs
when released from compression move the intermediate support plate 40 and the
processor upward such that carrier 62 and the processor may be picked up by a tool.
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