Appeal No. 2006-1466
Application No. 10/230,838
from a semiconductor device structure, which system comprises a wafer support, a
source of resist stripper, an applicator, a source of a chemical that forms gas in the
resist stripper, and a chemical output element in communication with the source of the
chemical and configured to direct the chemical toward the wafer support such that the
resist stripper substantially continuously moves across a surface of a component on the
wafer support (Brief, pages 4-5). Illustrative independent claim 1 is reproduced below:
A system for removing resist from a semiconductor device structure,
comprising:
a wafer support;
a source of resist stripper, the resist stripper including a gaseous component
comprising ozone;
an applicator in communication with the source and configured to apply a
quantity of the resist
stripper toward the wafer support;
a source of a chemical that forms gas in the resist stripper; and
a chemical output element in communication with the source of the chemical, the
chemical output element configured to direct the chemical toward the
wafer support such that the resist stripper substantially continuously
moves across a surface of a component on the wafer support.
The examiner relies on Noda et al. (Noda), U.S. Patent No. 6,517,998, issued on
February 11, 2003 (filed July 12, 2000), as the sole evidence of unpatentability (Answer,
page 2). Claims 1, 9 and 12 stand rejected under 35 U.S.C. § 102(e) as anticipated by
Noda (id.). We affirm the rejection on appeal essentially for the reasons stated in the
Answer, as well as those reasons set forth below.
OPINION
The examiner finds that Noda teaches a system for removing resist (photoresist)
from a semiconductor device structure comprising a wafer support, a source of resist
2
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