The opinion in support of the decision being entered today was not written for publication and is
not binding precedent of the Board.
UNITED STATES PATENT AND TRADEMARK OFFICE
__________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
__________
Ex parte KATSUMI YAMAGUCHI,
TAKAKO YAMAGUCH AND TOMOHIRO OKAZAKI
__________
Appeal No. 2006-1836
Application No. 10/087,556
___________
ON BRIEF
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Before KRASS, RUGGIERO, and BARRY, Administrative Patent Judges.
KRASS, Administrative Patent Judge.
DECISION ON APPEAL
This is a decision on appeal from the final rejection of claims 1-6 and 9-22.
The invention involves bump formation on a semiconductor device, best described by
reference to representative independent claim 1, reproduced as follows:
1. A semiconductor device, comprising:
a contact pad on a semiconductor substrate;
a conductive bump on said contact pad, said bump comprising a coaxially-aligned stack
of bodies having different cross-sectional dimensions, said bodies at the top of said stack
having smaller cross-sectional dimensions.
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Last modified: November 3, 2007