Appeal No. 2006-2525
Application No. 10/178,672
BACKGROUND
The invention relates to integrated circuits that support digital circuits, analog
circuits, and Radio-Frequency (RF) circuits on a single microchip. Representative claim
3 is reproduced below.
3. An integrated circuit, comprising:
a highly resistive substrate;
a patterned low resistivity buried layer formed directly on said highly
resistive substrate, wherein said patterned low resistivity buried layer has a same
conductivity type as said highly resistive substrate;
a digital circuit formed over said patterned low resistivity buried layer;
an anaIog circuit formed on said highly resistive substrate;
a passive RF device formed on said highly resistive substrate; and
an active RF device, wherein said active RF device is formed over said
highly resistive substrate and is not formed over the patterned low resistivity
buried layer.
The examiner relies on the following references:
Leipold et al. (Leipold) US 6,348,718 B1 Feb. 19, 2002
(filed May 14, 1999)
Celler et al. (Celler) US 6,388,290 B1 May 14, 2002
(filed Jun. 10, 1998)
Wong et al. (Wong) US 2002/0179977 A1 Dec. 5, 2002
(effective filing date no later than Sep. 6, 2001)
Claims 3-7 stand rejected under 35 U.S.C. § 103 as being unpatentable over
Celler and Leipold.
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