Except as otherwise provided in ORS 223.705 to 223.750, the provisions of ORS 223.205 and 223.210 to 223.295 or any charter shall apply to the rebonding application, to the form, to the manner of paying the amount entered in the bond lien docket, to the collection of delinquent installments and to issuance, sale and redemption of improvement bonds issued pursuant to ORS 223.725.
Section: Previous 223.705 223.710 223.715 223.720 223.725 223.730 223.735 223.740 223.745 223.750 223.755 223.760 223.765 223.770 223.775 NextLast modified: August 7, 2008