Advanced Delivery and Chemical Systems Nevada, Inc. - Page 3

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          product manufactured and sold by ADCS was tetraethylorthosilicate           
          (TEOS), which is used as an insulating and conducting material on           
          semiconductor computer chip wafers.                                         
               In 1988, Siegele started up ADCS with an initial                       
          capitalization of $150,000.  Initially, ADCS maintained its small           
          laboratory and manufacturing plant in Amherst, Wisconsin, and its           
          sales office in Siegele’s apartment in San Jose, California.                
          Beginning with its first year of operation, ADCS was successful             
          and profitable.                                                             
               In 1990, with a $72,000 10-year commercial bank loan which             
          it had obtained, ADCS purchased approximately 1.8 acres of land             
          in Burnet, Texas, on which ADCS constructed a new 3,000- to                 
          4,000-square-foot manufacturing plant into which ADCS relocated             
          its laboratory and manufacturing plant that had been located in             
          Amherst, Wisconsin.  The $72,000 bank loan was paid off in 1993.            
               In the early 1990s, ADCS developed and began manufacturing             
          stainless steel canisters that allowed for safe handling and                
          processing of TEOS and of other chemicals used in the computer              
               In the mid-1990s, ADCS developed and patented, and then                
          began manufacturing and selling, a dual canister chemical                   
          refilling system that allowed TEOS and other chemicals to be                
          continuously applied to computer chip wafers through a processing           
          tool without interrupting the chip manufacturing process while              

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Last modified: May 25, 2011