Appeal No. 95-0142
Application 07/817,961
unloading the wafer from the mounting surface while
continuing said supply of the inactive gas and said exhausting of
the vessel, thereby maintaining said flow of the inactive gas on
the wafer and the mounting surface; and
continuing said supply of the inactive gas and said
exhaustion of the vessel after unloading the wafer, thereby
maintaining said flow of the inactive gas on the mounting surface
and preventing by-products from adhering to the mounting surface
which has been cooled and exposed.
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Last modified: November 3, 2007