Appeal No. 1998-2948
Application 08/400,861
THE PRIOR ART
The Examiner relies on the following prior art:
Kiyota et al. (Kiyota) 5,296,653 March 22,
1994
Yamamoto et al. (Yamamoto)2 JP 7-45555 February 14,
1995
Hochido et al. (Hochido) JP 6-333926 December
2, 1994
Joshi et al. (Joshi), Aluminum-samarium alloy for
interconnections in integrated circuits, J. Vac. Sci.
Technol. A 8(3), May/June 1990, pp. 1480-1483.
Lee et al. (Lee), Annealing behavior of Al-Y alloy film
for interconnection conductor in microelectronic devices,
J. Vac. Sci. Technol. B, Vol. 9, No. 5, September/October
1991, pp. 2542-2547.
Kiyota discloses an active matrix liquid crystal display
wherein the interconnect lines are formed of an alloy of
aluminum and another element, including iron (Fe), cobalt
(Co), copper (Cu), tantalum (Ta), and titanium (Ti), having
low resistivity (col. 3, line 62 to col. 4, line 16). Kiyota
teaches that the defects due to breakage of the lines can be
reduced and "[t]he chemical resistance of the wiring layer of
the invention and the adhesivity with an insulating film
A translation of Yamamoto has been prepared by the2
U.S. Patent and Trademark Office and accompanies this
decision.
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