Ex parte ONISHI et al. - Page 10




         Appeal No. 1998-2948                                                      
         Application 08/400,861                                                    

         art in interconnection metallization.  Since Kiyota discloses             
         an Al-Cu alloy, the same alloy mentioned in Joshi, one of                 
         ordinary skill in the art would have been motivated to                    
         substitute an aluminum/rare earth element alloy for the Al-Cu             
         alloy in Kiyota given that Joshi teaches that an aluminum/rare            
         earth element alloy provides improved characteristics over                
         prior art Al-Cu (or, at least, teaches that an aluminum/rare              
         earth element alloy can be used in place of Al-Cu                         
         metallization alloy).  Yamamoto, the best reference, teaches              
         that aluminum/rare earth element alloys may be used                       
         alternatively to Al-Fe and Al-Co alloys as electrodes in LCDs.            
         Since Kiyota discloses Al-Fe and Al-Co alloys, one of ordinary            
         skill in the art would have been motivated to substitute an               
         aluminum/rare earth element alloy for the Al-Fe and Al-Co                 
         alloys of Kiyota given the teachings of Yamamoto.  For these              
         reasons, we conclude that the collective teachings of the                 
         references would have suggested the obviousness of                        
         substituting an aluminum/rare earth element alloy for the                 
         aluminum alloy in Kiyota.  The aluminum/rare earth element                
         alloy would still use an anodic oxidation film to increase the            
         chemical resistance during etching as taught by Kiyota.  As to            

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