Appeal No. 2004-0140
Application No. 10/154,729
unused high purity expensive sputtering material with low purity
Aluminum or steel, the cost of ownership will be reduced. This also
reduces the overall weight of the assembly by a substantial margin,
because the low purity Aluminum is much lighter than the sputtering
material (Titanium, Copper, Tantalum, Cobolt and Tungsten). The
reduction in weight will help reduce the need for special equipment
for placing the targets into the sputtering chambers and may reduce
the likelihood of particle generation caused by manipulating the
cumbersome target into the system.
Prior Art:
New design target for OEM. Targets being produced today are
monolithic in design
Disadvantages of Prior Art
These are several disadvantages to the product being made today:
- Expensive unused target sputtering material (material
efficiency)
- Weld issues with exotic materials such as Ta, Ti, Cu, Co
and W
- Weight of sputtering material is much greater than Aluminum
- Difficult to product in monolithic design
Identify the mode of operation parts and step of the invention:
The target assembly is made up of commercial grade Al alloy or
steel to sputtering material such as Titanium, Copper, Tantalum,
Cobolt and Tungsten. Attached are drawings to describe the
assembly. The outer wall of the assembly is the commercial grade
Aluminum alloy or steel and on the interior is the bonded sputtering
material (Ta, Ti, Cu, Co and W). There are currently two methods
used to bond the two materials. The first is a shrink fit design using
the differences in thermal heat expansion between the sputtering
material and the commercial grade Aluminum alloys. The
differences are enough to create a bond, which can sustain
substantial shear stress. The second and safe method is to diffusion
bonding the two materials creating a strong chemical bond. Both
-5-
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Next
Last modified: November 3, 2007