Ex Parte Holcomb et al - Page 9




                      Appeal No. 2004-0140                                                                                                       
                      Application No. 10/154,729                                                                                                 

                              Appellants assert that the particular timing of the bonding and formation are                                      
                      not set forth in the appealed claims.  (Brief, p. 5).  Appellants assert that the                                          
                      limitation of claim 27, “forming said first metallic material and said second metallic                                     
                      material into a cup-shaped sputter target assembly including an outer shell                                                
                      composed of said second metallic material and a sputtering insert composed of said                                         
                      first material”, is disclosed in the provisional application by the following:                                             
                              Page 1, lines 21-22 and the Drawing Figure.  Under the headings                                                    
                              “Shrink Fit Method” and “Diffusion Bond Technique,” the materials                                                  
                              are machined (i.e. formed) into the cup shaped shown in the drawings.                                              
                      [Brief, p. 6].                                                                                                             
                              We agree with Appellants that timing of the bonding and formation are not                                          
                      set forth in the appealed claims.  We find that the drawing figure of the provisional                                      
                      application does not provide information about the method of forming the sputter                                           
                      target assembly but is representative of the product.  However, contrary to                                                
                      Appellants’ position, we find that the discussion in the provisional application                                           
                      describing the bonding techniques under the headings identified by the Appellants                                          
                      provides a specific order for the forming and bonding steps.  In each description, the                                     
                      metallic materials are formed prior to bonding.  In each description the sputtering                                        
                      material is machined and subsequently placed into the Aluminum alloy before they                                           
                      are bonded.                                                                                                                

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