Appeal No. 94-3284
Application 07/948,570
a circuit subassembly having bond pads and streets;
a primary passivation layer on the surface of the
subassembly which is etched at the bond pads and streets; and
one or more ceramic layers covering the primary passivation
layer and the sides of the primary passivation created by etching
at the bond pads and streets;
wherein the ceramic layers comprise a ceramic material which
is deposited by a process selected from the group consisting of
chemical vapor deposition and physical vapor deposition.
The references relied upon by the primary examiner in the
final rejection are:2
Haluska et al. (Haluska) 4,849,296 Jul. 18, 1989
Kobayashi et al. (Kobayashi) 5,177,589 Jan. 5, 1993
(filed Sept. 25, 1991)
Claims 12 to 23 stand finally rejected:
(1) as failing to comply with the second paragraph of 35 U.S.C.
§ 112;
(2) as unpatentable over Haluska in view of Kobayashi, under
35 U.S.C. § 103.
Rejection (1)
The examiner takes the position that the claims are
indefinite, because the expression “one or more ceramic layers,”
found in each of independent claims 12, 15 and 19, is
“alternative claim language” which, according to the MPEP, makes
2It is noted that the number given in the examiner’s
answer (page 2) for the Haluska et al. patent is incorrect.
-2-
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