Appeal No. 97-0819
Application 08/252,063
comprising a first silicon base, one side of which is used as
the substrate for the manufacture of the different elements of
the electronic component, and comprising a second based made
of a material having a greater mechanical strength than
silicon, which is fixed to the other side of said first base,
the second base being fixed to a film which acts as an element
to close the cavity.
21. An electronic component support module for a memory card
having a cavity to house an electronic component,
said
support module comprising:
a chip having an electronic component manufactured on a
first side of said chip;
a material having a greater mechanical strength than
silicon
on a second side of said chip, opposite to said
first
side;
a resin material encapsulating exposed surfaces of said
electronic component and said material having a
greater
mechanical strength than silicon;
wherein said electronic component support module has a
thickness not exceeding about 600 microns.
The appealed claims as represented by claims 10 and 21
are drawn to a “support” or “support module” for electronic
components for “memory” cards, which “support” or “support
module” is characterized as having a layer or “base” which is
“made of a material having a greater mechanical strength than
silicon.”
The examiner has rejected the appealed claims under
35 U.S.C. § 112, first paragraph, enablement, in three groups:
appealed claims 10, 17 through 19, 21, 22 and 28; appealed
claims 10 through 27; and, appealed claims 21 and 23 through
28.2 We reverse.
2 The other two grounds of rejection, i.e., “Issue 1” and
“Issue 3” (answer, pages 3-4) were withdrawn by the examiner
(answer, page 4, and supplemental answer, page 1).
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