Appeal No. 95-1987
Application 08/076,475
[t]heoretically, the dielectric con-
stant, the dielectric dissipation factor,
and the dielectric loss factor required to
accomplish high frequency dielectric heat-
ing at a frequency less than 100 MHZ are
preferably determined at ,' = 4.0, tan* =
0.05, and ,'tan* = 0.20, respectively.
Another feature of appellants' invention is the
purported discovery that rubber compositions including
alkylene glycol and/or chlorinated rubber exhibit the
theoretical preferred characteristics regarding the dielectric
loss factor. See the specification at page 9, lines 38-44.
Separate claims on appeal are directed to this subject matter.
As evidence of obviousness of the claimed invention,
the examiner principally relies on Itoh. This reference
discloses a process which employs "high frequency" dielectric
heating to effect rubber vulcanization within a mold to obtain
"burr-free" rubber moldings. See the reference at column 1,
lines 21-33. The Itoh process, like the claimed process,
therefore involves a procedure which vulcanizes rubber
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