Ex parte YAGURA et al. - Page 4




          Appeal No. 95-5148                                         Page 4           
          Application 08/121,794                                                      
                                     DISCUSSION                                       
               We are unpersuaded, based on the record before us, that                
          the combination of the admitted prior art and Yamagishi would               
          have rendered the subject matter of the claims obvious.                     
          Yamagishi's suggestion to use a WN/TaN laminate is an                       
          empirical solution to a specific problem.  The examiner has                 
          not convincingly explained why a person having ordinary skill               
          in the art would have been motivated to try a single nitride,               
          e.g., WN (not TaN or WN/TaN), as a barrier layer in the                     
          admitted prior art.  The analysis the examiner presented                    
          appears to be impermissible hindsight.                                      
                               NEW GROUND OF REJECTION                                
               Although the examiner never makes a rejection based on                 
          Wittmer, the combination of Wittmer and the admitted prior art              
          strongly suggests the claimed invention.  Wittmer teaches that              
          at high temperatures the metallic layer (in his case, aluminum              
          (Al)) decomposes, and forms compounds with, silicides.                      
          (p. 276.)  For this reason, he reports that "transition metal               
          silicides cannot be used as barrier material."  (p. 279,                    
          emphasis added.)  In contrast, Wittmer teaches that "[t]he                  
          performance of [another material] is only surpassed by                      
          refractory metal nitride barriers, such as TiN and ZrN."                    
          (Id., emphasis added.)  TiN (titanium nitride) is in                        





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