Appeal No. 96-0317
Application 08/042,185
THE INVENTION
The subject matter of appellants’ claimed invention is directed toward a method for
bonding a silicon-containing composition, such as a sputtering target, to a metal surface,
such as the surface of a cooling plate, by arc spraying onto a coarse silicon-containing
surface, in order, a metal adhesion layer, a solderable layer and a solder layer, and
soldering the solder layer to the metal surface. Claim 1 is illustrative and reads as follows:
1. A method for bonding a silicon-containing composition to a metal surface
comprising the steps of:
a. providing a coarse silicon-containing surface;
b. arc-spraying a metal adhesion layer onto the coarse silicon-containing surface;
c. arc-spraying a solderable layer onto the metal adhesion layer;
d. arc-spraying a solder layer onto the solderable layer; and
e. soldering the solder layer to the metal surface.
THE REFERENCES
Lindmayer (Lindmayer ‘391) 4,297,391 Oct. 27, 1981
Lindmayer (Lindmayer ‘812) 4,492,812 Jan. 8, 1985
Leas 4,511,600 Apr. 16, 1985
W.E. Ballard, “Preparation of Surfaces for Metal Spraying”, Metal Spraying and Sprayed
Metal, Ch. VI, 95-119 (Charles Griffin & Co., London, 3d ed. 1948) (Ballard).
THE REJECTION
2
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