Appeal No. 97-2488
Application 08/163,202
As to the concerns of the examiner relative to
claim 22, we find that the step of selectively coating “for
providing . . .” (lines 3 through 16) gives the impression that
this step of coating is intended to provide the specifically
recited conductive paths, passages, conductive lands, and
soldering bridges listed within this method step. On the other
hand, the etching step is recited as removing areas of conductive
film “in order to provide said conductive paths, conductive lands
and soldering bridges and passages through the conductive film.”
The latter etching step thus appears to clarify that the coating
step
is for providing the material (layer of conductive film) acted
upon by etching in order to provide the conductive paths,
passages, conductive lands, and soldering bridges. This under-
standing comports with appellants’ view of the matter (amended
main brief, page 6). A similar situation is presented in process
claim 42 wherein respective coating steps for providing
conductive paths, conductive lands, and soldering bridges
projecting into passages, precedes the etching step removing
leads to the lands (lines 31 through 33).
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