Appeal No. 97-2488
Application 08/163,202
areas of the conductive film in order to provide the conductive
paths, conductive lands and soldering bridge means and to provide
passages through the conductive film. We, accordingly,
understand this aspect of claim 42 for the same reason addressed
in our analysis of the comparable language in claim 22, supra.
Thus, as to the aforementioned matters pertaining to steps of
coating and etching, it appears to us that the language of claims
22 and 42 can be fairly comprehended.
A problem area of indefiniteness which persists in
claims 22 and 42, however, relates to the recitation of the
soldering bridges “for producing desired solder joint
configurations between the lands and leads” (claim 22, lines 15
and 16) and “for producing a desired solder joint configuration
between the lands and leads” (claim 42, lines 13 and 14). In
subsequent portions of these claims, the respective steps of
providing a
first layer “for providing said desired solder joint
configurations” (claim 22, lines 23 and 24) and providing blanket
coverings “for producing said desired solder joint
configurations” (claim 42, lines 24 and 25) appear. The
specified content of these latter steps clearly contradicts the
8
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 Next
Last modified: November 3, 2007