Ex parte KHAN et al. - Page 3




           Appeal No. 97-3246                                                                        
           Application 08/384,090                                                                    


           (Matsumoto)                   5,444,335                     Aug.  22, 1995                
           Kimura                                                                                    
           (European Patent Application)    0 597 432                  May   18, 1994                




                 Claims 11 through 13, 15 and 16 stand rejected under                                
           35 U.S.C. § 102(b) as anticipated by Iwama.  Claims 14 and 16                             
           stand rejected under 35 U.S.C. § 103.  As evidence of                                     
           obviousness, the examiner cites Iwama and Matsumoto with                                  
           regard to claim 14 and Iwama and Tanamachi with regard to                                 
           claim 16.                                                                                 
                 Reference is made to the briefs and answer for the                                  
           respective positions of appellants and the examiner.                                      


                                               OPINION                                               
                 Turning first to the rejection under 35 U.S.C. § 102(b),                            
           the examiner contends that Iwama discloses all that is claimed                            
           but for the anodically bonding the thin sheet to the                                      
           substrate.  Appellants apparently agree with this analysis                                
           based on a lack of argument in this regard as to any                                      
           particular claim limitation save for the anodically bonding.                              

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