Appeal No. 95-4927
Serial No. 08/216,772
DECISION ON APPEAL
This is an appeal under 35 U.S.C. § 134 from the
examiner's rejection of claims 1 and 3-12, all of pending
application claims, under 35 U.S.C. § 103. We affirm.
Appellants’ Figure 1 is a copy of Figure 12 of Spairisano
et al. U.S. Patent 4,888,307, which is a perspective view of a
resin-encapsulated, three-lead semiconductor device appellants
describe as capable of resisting voltages up to 1,500 volts AC
(Spec. at 2, lines 11-16).2
Appellants’ invention is a resin-encapsulated
semiconductor device package designed to withstand voltages of
at least 2,250 volts AC (Spec. at 3, lines 3-6). Referring to
the three-lead embodiment shown in appellants’ Figures 2-4,
the center lead 27 extends in a first plane from the body of
the package while the other leads 28 and 29 each have two 90E
bends therein so that their outer end portions lie in a second
plane. Furthermore, a portion of center lead 27 adjacent to
2Although the leads in these figures and in Spairisano
et al. Figures 1 and 5 appear to be in two different planes,
that appears to be a drawing error, because the leads are not
shown in different planes in Spairisano et al.’s elevation
views, nor are they described in the specification as being so
disposed.
- 2 -
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 Next
Last modified: November 3, 2007