Appeal No. 95-4927
Serial No. 08/216,772
results in long internal leads 6 and 7 having an inductance
that detracts from the high-frequency operation of the
semiconductor device (p. 3, lines 19-27). Mizuguchi solves
both of these problems by forming each of leads 2 and 4 with a
pair of 90E bends (9, 10) as shown in Figure 3 so as to reduce
the length of the internal leads 6 and 7 and provide bends for
inclusion within the resin body in order to increase the
mechanical support for leads 2 and 4 (p. 4, line 19 to p. 5,
line 5).
Yasui shows various resin semiconductor housings designed
to reduce current leakage between leads and along the surface
of the housing during operation in a moist atmosphere (col. 1,
lines 39-56; col. 2, lines 1-6). This is achieved in the
embodiment of Figures 3A and 3B by enclosing a portion of the
center lead adjacent to the housing with resin, thereby
creating steps 28 in the housing surface which increase the
surface distance between adjacent leads (col. 3, lines 13-19).
Inasmuch as the statement of the rejection does not
appear in the December 23, 1994, final Office action, we look
to the preceding Office action, dated June 23, 1994, wherein
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