Appeal No. 95-5066
Serial No. 07/931,330
Dubuisson describes a monolithic substrate for an electronic power component which is formed
by a sintered stack of layers of dielectric material having an internal system of ducts for the circulation of
a cooling system (abstract; column 2, lines 10-46; column 2, line 67 - column
3, line 13). Such substrates can be used both for carrying semi-conductor devices at a high
density or as substrates for producing hybrid circuits (column 1, lines 17-20). As noted by Dubuisson,
use of power components or a high density of components, often necessitates
...dissipat[ing] a substantial amount of heat which is given off by the components. By
way of example, it is often necessary to dissipate an amount of power of the order of
35 watts by means of a substrate of standardized dimensions of 152.4 x 86.36 mm.
(column 1, lines 35-39)
The examiner acknowledges that Hamuro does not teach staggering welds between
successively welded sheets (Substitute Answer page 10, paragraph one). However, according to the
examiner, (a) Ketcham and Dubuisson suggest forming of green laminates with X-Y planar dimensions
of one or more meters, (b) formation of such meter-sized green laminates necessarily requires tack
bonding in at least one or several interior locations of the stacked sheets, and (c) a Dubuisson laminate
could not be tack welded without staggering or omitting at least one tack within the interior of the
multilayered green stack because the probability of a desirable interior
Z-directional portion of the stack being free of both electrical metallization and cooling channels
diminishes with the complexity of the laminate. Thus, the examiner concludes it would have
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