Appeal No. 96-1705
Application No. 08/296,269
This is a decision on the appeal under 35 U.S.C. § 134
from the examiner’s rejection of claims 2-6, 8 and 9, which
constitute all the claims remaining in the application.
The disclosed invention pertains to an encapsulated
semiconductor module of the type in which a lead frame is
bonded to a semiconductor chip. The lead frame has a
plurality of conductive fingers cut from sheet stock and
having proximal and distal ends. The proximal ends of the
conductive fingers are provided with coined bonding regions
having a thickness less than the thickness of the sheet stock.
Representative claim 2 is reproduced as follows:
2. An encapsulated semiconductor module comprising:
a semiconductor chip having a major surface with
terminals thereon disposed within an encapsulated material;
a lead frame comprising a plurality of self
supporting unitary, discrete, and continuous lead frame
conductive fingers, formed of metal sheet stock extending over
said major surface of said chip at spaced locations from said
terminals,
the proximal end of said conductive fingers arranged
in a fixed spacing and provided with a coined bonding region
adapted to provide a wire bond contact area, and
2
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