Appeal No. 96-4180
Application No. 08/225,138
of the slug 14 spaced from the substrate 16 and the diameter
of the solder balls 24. Appellants further emphasize the
importance of the collapse distance 44 in Figure 3, described
on page 13 of the specification, determined by the slug 14.
The independent claim 1 is reproduced as follows:
1. A packaged integrated circuit, comprising:
a substrate having first and second surfaces, and having
an opening disposed therethrough, and having a plurality of
electrical conductors;
a slug, comprised of a thermally conductive material and
having first and second surfaces, the first surface of the
slug lying below the plane of the first surface of the
substrate, wherein a portion of the second surface of the slug
is connected to the first surface of the substrate, the
remaining portion of the second surface of the substrate being
exposed in the opening;
an integrated circuit chip, mounted to the exposed second
surface of the slug, and electrically connected to the
conductors of the substrate; and
a plurality of solder balls disposed at the first surface
of the substrate and in electrical connection with the
conductors of the substrate, for making electrical connection
to a circuit board;
wherein the slug extends below the plane of the first
surface of the substrate by a distance selected to define a
desired shape for the plurality of solder balls when the
integrated circuit package is mounted to the circuit board.
The Examiner relies on the following references:
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