Appeal No. 1997-0123
Application 08/368,926
been canceled. Claims 4, 7, 10, and 13 have been indicated by
the
Examiner as containing allowable subject matter but are
objected to as being dependent on a rejected claim . 2
The claimed invention relates to a packaged semiconductor
chip with radial slots formed in an inner ring of contact lead
support film and cross-slots formed in the corner members of
an outer body of support film. Appellants state at page 4 of
the specification that the slots permit expansion of the
various portions of the support film and prevent breakage of
the contact leads due to differences in the thermal
coefficient of expansion between the semiconductor material
and the support film.
Claim 3 is illustrative of the invention and reads as
follows:
3. A packaged semiconductor chip comprising:
2 Although Appellants have included claims 4, 7, 10, and
13 in the reproduction of the appealed claims in the Appendix
to the Brief, these claims are not before us in this appeal.
2
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