Appeal No. 1997-0123
Application 08/368,926
a semiconductor chip;
a plurality of contact leads electrically connected to
the semiconductor chip;
an inner ring of film surrounding the semiconductor chip
and supporting a portion of the contact leads;
an outer body of film surrounding the inner ring of film
and connected to the inner ring of film by four corner members
of film material, the outer body of film supporting a further
portion of the contact leads;
and
each of the corner members comprising at least one cross-
slot extending inward from an edge of the corner member
partway across the corner member such that stress on the
contact leads resulting from the thermal expansion and
contraction of the semiconductor chip, the inner ring of film
material and the outer body of film material is reduced.
The Examiner relies on the following references : 3
Nakamura et al. (Nakamura) 62-113458 May 25,
1987
(Japanese Kokai)4
Suetake 5,336,927 Aug. 09,
1994
Claims 3, 5, 6, 8, 9, 11, 12, and 14 stand finally
3 The Examiner additionally relies on a description of the
admitted prior art at pages 2 and 3 of Appellants’
specification.
4A copy of the translation provided by the U. S. Patent
and Trademark Office, April 1999, is included and relied upon
for this decision.
3
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