Appeal No. 1997-1186
Application No. 08/319,913
bonded to glass base (32) which is in turn mounted on the
mounting flag (Figures 1 and 3). The examiner has determined
that “neither Hingorany nor Ishibashi discloses the mounting
flag with an opening to receive a first pressure (since it is
not a differential pressure sensor), a housing with first and
second ports for receiving first and second pressures, a
sensor die eutectically mounted to provide a hermetic seal
between the sensor die and mounting flag, nor [sic, or] the
use of gold as a bonding surface” (Answer, page 5).
The examiner has relied on Tominaga, Wamstad and Hynecek
as secondary references to make up for the above-noted
deficiencies in Hingorany and Ishibashi. Tominaga discloses a
differential pressure sensor (Figure 2) wherein an alumina
base 22 has an opening upon which a sensor die is disposed.
The examiner has taken the position that it would have been
obvious to one of ordinary skill in the art to use a pressure
sensor as the semiconductor device in Hingorany “as is shown
by Ishibashi, and to further provide openings in the mounting
flag to receive a first pressure, as well as separate openings
in the housing to receive a first and second pressure, as
disclosed by Tominaga (‘501), in order to configure the sensor
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